| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical shape-measuring apparatus which can accurately measure shape, e.g. flatness and thickness, of a thin planar sample, especially a wafer. SOLUTION: The optical shape-measuring apparatus comprises optical measuring means 10, 20 provided with two reference planar substrates 15, 25 disposed opposite on the major surface 1a side and the rear surface 1b side of a wafer 1 held substantially vertically via an edge part, and transparent rigid plates 19, 29 disposed between the referential planar substrates 15, 25 and the wafer 1 in the proximity of the wafer, while forming a parallel gap with respect to the wafer 1. |
