| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor device mounting unit, a method of manufacturing the semiconductor device, and a method of manufacturing the semiconductor device mounting unit which enable improvement of the productivity of flip-chip connection. SOLUTION: This semiconductor device has a semiconductor chip having pads for the external connections; an insulation layer formed on the surface of the semiconductor chip where the pads are formed; and conductor layers which are formed on the insulation layer, have areas larger than the areas of the pads, and are connected electrically with the pads via conductors piercing through the insulation layer. As the conductor layers, having the larger areas than the pads formed on the chip, are used as terminals for the external connections instead of the pads, the precision of the alignment of the semiconductor device can be rough corresponding to the areas of the conductor layers larger than the areas of the pads regardless of the fineness of wiring patterns on a wiring board which is connected to the semiconductor device with the flip-chip connection, so that the efficient alignment can be practiced and hence the productivity of the flip-clip connection can be improved. |
