Junction structure of terminal pad and solder, semiconductor device having the junction structure, and method of manufacturing the semiconductor device

摘要

The present invention provides a semiconductor device which comprises a terminal pad ( 120 ) formed on an underlying base ( 105 ), solder ( 240 ), and a reactive product ( 260 ) comprising a component of the terminal pad and a Zn system material ( 230 ), which is formed between the terminal pad and the solder.