APPARATUS FOR MOLDING THE SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a device for molding a semiconductor device. The device comprises: a supply unit configured to supply a pellet; a selection unit configured to select a pellet matched with a reference value; a first loading unit configured to transfer and load a pellet, arranged on a first arrangement hole, to an upper portion; a transfer unit configured to horizontally transfer the first loading unit in a first direction or a second direction; and a second loading unit configured to discharge a pellet to a lower mold for loading. Therefore, the device prevents defective products due to foreign materials during a molding process.