发明名称 PRINTED CIRCUIT BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce a cost for providing attribute identification information to a printed circuit board in the printed circuit board. SOLUTION: A printed circuit board 10 is equipped with: a substrate 11a; an attribute identification information indication unit 12 which displays identifying an attribute according to an identification whether solder is fixed on a partial pad front surface or entire pad front surface in identification pads distributed and provided on a front surface of the substrate 11a; and surface mounted parts 13 which are mounted through solder fixed on a front surface of a wiring pad 11b distributed and provided on the front surface of the substrate 11a. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009135300(A) 申请公布日期 2009.06.18
申请号 JP20070310785 申请日期 2007.11.30
申请人 TOSHIBA CORP 发明人 MIURA SONOKO
分类号 H05K1/02;H05K3/00;H05K3/34 主分类号 H05K1/02
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