INDUCTION BONDING MATERIALS, LAMINATE-SUBSTRATE ASSEMBLIES THEREOF, AND METHODS OF MAKING SUCH LAMINATES AND ASSEMBLIES

摘要

An induction bonded assembly comprises a sealantless induction bondable laminate having at least a lower metal foil laver and a polymer support layer above the lower metal foil layer, the sealantless induction bondable laminate being free of a lower heat-sealant layer so that the metal foil layer forms the bottom layer thereof; and a substrate, separate from the sealantless induction bondable laminate, induction bonded to the lower metal foil layer of the sealantless induction bondable laminate.