发明名称 SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering method that can be easily implemented in a short time and can attain uniform bonding strength at low cost.SOLUTION: A soldering method comprises: a first process of placing a plurality of metal components to be joined one over another with joining object regions in contact with one another; a second process of fixing the joining object regions, put one over another, by winding a joining auxiliary metal wire around outer peripheral parts of the joining object regions having been put one over another; a third process of arranging solder over the joining object regions; and a fourth process of soldering the joining object regions of the plurality of metal components together by fusing the solder by induction heating and also soldering the joining auxiliary metal wire and the joining object regions of the plurality of metal components together.SELECTED DRAWING: Figure 5
申请公布号 JP2016215213(A) 申请公布日期 2016.12.22
申请号 JP20150100196 申请日期 2015.05.15
申请人 MITSUBISHI ELECTRIC CORP 发明人 CHUBO MASATO;YASUDA SHINJI
分类号 B23K3/00;B23K1/00;B23K1/002 主分类号 B23K3/00
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