发明名称 INDUCTION HEATING DEVICE, INDUCTION HEATING METHOD, AND HEATING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a heating device well and efficiently heating by induction. <P>SOLUTION: A bypass serial circuit C3 formed by serially connecting a first split capacitor C3A and a second split capacitor C3B, of which grounding points are grounded, is connected between a secondary winding side first split winding 212A and a secondary split winding 212B of a first transformer 210 connected to a first oscillation means 221 outputting high frequency alternating current power, through a conductor L1 of which a first conducting plate L1A and a second conducting plate L1B face through an inter-plate gap setting inductance of the conducting plates so as to become serial resonance frequency corresponding to the high frequency. Feedback can be prevented without arranging a reactor for preventing feedback, and an effective induction heating can be obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344386(A) 申请公布日期 2006.12.21
申请号 JP20050166381 申请日期 2005.06.07
申请人 HIGH FREQUENCY HEATTREAT CO LTD 发明人 IKUTA FUMIAKI;YO YAKU;KOBAYASHI KUNIHIRO
分类号 H05B6/04;C21D1/10;C21D1/42;H02M7/48;H02M7/493 主分类号 H05B6/04
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