| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability in a semiconductor device, to suppress increase in cost in assembling the semiconductor device, and to improve the reliability and quality of the assembling. <P>SOLUTION: A cross-section surface of an edge of a slit continuing into an edge part of a peripheral part of a brade 13 is formed in a circular shape, and a curvature radius of the circular of the cross-setion surface is formed larger as in a direction of a rotation center of the brade 13. This can take in a water for cooling when a multiple pickup substrate 9 including a feeding wire 5d is discretely diced. This can decrease a cutting resistance to suppress an occurrence of a clogging of the brade 13, which decreases burrs, chippings, chips, and cracks of the feeding wire 5d. <P>COPYRIGHT: (C)2007,JPO&INPIT |
