发明名称 METHOD OF SELECTIVE-ETCHING THIN FILM FORMED ON VERTICAL STRUCTURE AND METHOD OF MANUFACTURING MEMORY DEVICE USING THE SAME METHOD
摘要 A method for selectively etching a thin film deposited on a vertical structure is provided to form desired various patterns by selectively etching a thin film deposited on a vertical structure by a simple process. A vertical structure(20) is formed on a substrate(10) by using a first material. A thin film is deposited on the outer surface of the vertical structure by using a second material. A resist material is deposited on the substrate so that the lateral lower part of the thin film is covered with the resist material and the upright upper part and the lateral upper part of the thin film are exposed. The upright upper part and the lateral upper part of the thin film are wet-etched to expose the upper region of the vertical structure surrounded by the upright upper part and the lateral upper part of the thin film. The resist material is removed. The vertical structure can be made of one of a nano wire, a post or a cylinder.
申请公布号 KR100846514(B1) 申请公布日期 2008.07.17
申请号 KR20070011793 申请日期 2007.02.05
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, JAE EUN;CHA, SEUNG NAM;JUNG, JAE EUN;JIN, YONG WAN
分类号 H01L21/302 主分类号 H01L21/302
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