SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

摘要

After completing a baking process of a reflection preventing film (step (S12)), substrate peripheral portion cleaning process (step (S13)) is performed prior to performing resist film application process (step (S14)). At the time of forming the reflection preventing film, sometimes fine particles such as sublimate are generated and adhered to the substrate peripheral portion. Such fine particles can be removed by cleaning the peripheral portion of the substrate, and a resist cover film can be formed on the substrate having the clean peripheral portion. Thus, the fine particles are prevented from being sandwiched between the surface of the substrate peripheral section and the resist cover film, and peeling of the resist cover film is eliminated at the peripheral portion of the substrate.