| 发明名称 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices |
| 摘要 |
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes forming a mask coating over a carrier, coupling an integrated circuit die over the mask coating, and disposing a molding compound around the integrated circuit die. The method includes forming an interconnect structure over the integrated circuit die and the molding compound. |
| 申请公布号 |
US2016190096(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201615062757 |
申请日期 |
2016.03.07 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Liu Chung-Shi;Huang Chih-Fan;Huang Hui-Min;Lin Wei-Hung;Cheng Ming-Da |
| 分类号 |
H01L25/065;H01L23/528;H01L23/00;H01L23/367;H01L23/04;H01L23/31;H01L23/29 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged semiconductor device, comprising:
an integrated circuit die; a molding compound disposed around the integrated circuit die; a mask coating disposed over a first side of the integrated circuit die and the molding compound; and an interconnect structure disposed over a second side of the integrated circuit die and the molding compound, wherein the second side is opposite the first side. |
| 地址 |
Hsin-Chu TW |
