HIGH FREQUENCY INTEGRATED CIRCUIT AND PACKAGING FOR SAME

摘要

An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.

主权项

1. An integrated circuit package comprising:
an integrated circuit comprising a circuit and a plurality of bond pads electronically connected to the circuit; and a package structure comprising a plurality of leads connected to a plurality of the bond pads by a plurality of wire bonds, wherein a group of five consecutive bond pads of the plurality of bond pads connected to the leads comprise two signal bond pads configured to transmit the same signal and three return bond pads, one return bond pad being between the two signal bond pads and the other two return bond pads being adjacent the two signal bond pads on opposite sides of the group.