MOLD RELEASE FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR PACKAGE

摘要

To provide a mold release film which is excellent in releasability and capable of suppressing contamination of a mold or a resin-encapsulation portion by the mold release film and which is capable of forming a resin-encapsulation portion excellent in adhesion to an ink layer, and a process for producing a semiconductor package using the mold release film. A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least the first surface is made of a fluororesin, and in a specific test method, F/Al is from 0.2 to 4, or F/(C+F+O) is from 0.1 to 0.3.

主权项

1. A mold release film to be disposed on a cavity surface of a mold in a method for producing a semiconductor package wherein a semiconductor element is disposed in the mold and encapsulated with a curable resin to form a resin-encapsulation portion, characterized in that
it has a first surface to be in contact with the curable resin at the time of forming the resin-encapsulation portion, and a second surface to be in contact with the cavity surface, at least the first surface is made of a fluororesin, and F/Al in the following test method A is from 0.2 to 4, or F/(C+F+O) in the following test method B is from 0.1 to 0.3:
A 1 mm thick cardboard, the mold release film, a 0.1 mm thick aluminum plate made of A1N30H—H18 material in accordance with JIS H4160 and a 1 mm thick cardboard are piled in this order so that the first surface and the aluminum plate are in contact with each other, and pressed for 5 minutes under conditions of 180° C. and 5 MPa, whereupon the mold release film is peeled off from the aluminum plate, and the surface of the aluminum plate which was in contact with the mold release film, is analyzed by an X-ray photoelectron spectroscopy to obtain the ratio (F/Al) of fluorine atoms to aluminum atoms,
On a 3 mm thick first metal plate of a square shape with a size of 15 cm×15 cm, a 100 μm thick aluminum foil of a square shape with a size of 15 cm×15 cm is placed, on the aluminum foil, a 100 mm thick spacer of a square shape with a size of 15 cm×15 cm having a rectangular hole of 10 cm×8 cm opened at its center, is placed, in the vicinity of the center of the hole, 2 g of the following epoxy resin is placed, further thereon, the mold release film of a square shape with a size of 15 cm×15 cm is placed to let the first surface be on the spacer side, and thereon, a 3 mm thick second metal plate of a square shape with a size of 15 cm×15 cm is placed, to prepare a laminated sample; the laminated sample is pressed for 5 minutes under conditions of 180° C. and 10 MPa to cure the epoxy resin; after the pressing, the second metal plate, the mold release film and the spacer are removed, and the surface of the cured product of the epoxy resin that was in contact with the mold release film, is analyzed by an X-ray photoelectron spectroscopy to obtain the ratio (F/(C+F+O)) of fluorine atoms to the sum of carbon atoms, fluorine atoms and oxygen atoms: Epoxy resin: epoxy granular resin for encapsulating semiconductors, trade name: SUMIKON EME G770H type F ver. GR, manufactured by Sumitomo Bakelite Co., Ltd.