发明名称 ENCAPSULATING LAYER, ELECTRONIC PACKAGE DEVICE AND DISPLAY APPARATUS
摘要 This present disclosure provides an encapsulating layer, an electronic package device and a display apparatus, relates to the field of electronics technology, and may decrease the thickness of the encapsulating layer, thereby achieving lightening and thinning of the electronic package device. The encapsulating layer comprises an encapsulating barrier layer and an organic coating layer directly formed on the encapsulating barrier layer; wherein the organic coating layer is a polymerizable organic coating layer; and the polymerizable organic coating layer comprises an unsaturated acrylate organic coating layer. The encapsulating layer is used for encapsulating an electronic device.
申请公布号 US2016301032(A1) 申请公布日期 2016.10.13
申请号 US201514777774 申请日期 2015.01.22
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 Wang Tao;Zhou Weifeng;Zhang Song;Sun Tao
分类号 H01L51/52;H01L51/00 主分类号 H01L51/52
代理机构 代理人
主权项
地址 Beijing CN