发明名称 Semiconductor Device with Cell Trench Structures and a Contact Structure
摘要 A semiconductor device includes first and second cell trench structures extending from a first surface into a semiconductor body, a first semiconductor mesa separating the cell trench structures. The first cell trench structure includes a first buried electrode and a first insulator layer. A first vertical section of the first insulator layer separates the first buried electrode from the first semiconductor mesa. The first semiconductor mesa includes a source zone of a first conductivity type directly adjoining the first surface. The semiconductor device further includes a capping layer on the first surface and a contact structure having a first section in an opening of the capping layer and a second section in the first semiconductor mesa or between the first semiconductor mesa and the first buried electrode. A lateral net impurity concentration of the source zone parallel to the first surface increases in the direction of the contact structure.
申请公布号 US2016300945(A1) 申请公布日期 2016.10.13
申请号 US201615188217 申请日期 2016.06.21
申请人 Infineon Technologies AG 发明人 Laven Johannes Georg;Cotorogea Maria
分类号 H01L29/78;H01L21/265;H01L29/417;H01L29/10;H01L29/06;H01L29/08 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device, comprising: a first and a second cell trench structure extending from a first surface into a semiconductor body, wherein a first semiconductor mesa separates the first and second cell trench structures, the first cell trench structure comprises a first buried electrode and a first insulator layer, a first vertical section of the first insulator layer separates the first buried electrode from the first semiconductor mesa, and the first semiconductor mesa comprises a source zone of a first conductivity type directly adjoining the first surface; a capping layer on the first surface; and a contact structure comprising a first section in an opening of the capping layer and a second section in the first semiconductor mesa or between the first semiconductor mesa and the first buried electrode, wherein a lateral net impurity concentration of the source zone parallel to the first surface increases in the direction of the contact structure.
地址 Neubiberg DE
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