METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE SAME

摘要

A method for manufacturing a semiconductor device is provided. The method includes disposing pre-conductive lines and post-conductive lines for forming first and second cells. The first and second cells are adjacent to each other in a first direction. A first conductive line of the first cell extends in a second direction perpendicular to the first direction and is adjacent to a boundary between the first and second cells. A second conductive line and a third conductive line of the second cell extend in the first direction and are adjacent to the boundary. The second and third conductive lines are respectively disposed on two non-adjacent tracks, among a plurality of tracks that extend in the first direction. The first conductive line intersects one of the two non-adjacent tracks and one track disposed between the two non-adjacent tracks.

主权项

1. A method for manufacturing a semiconductor device, the method comprising:
disposing pre-conductive lines for forming a first cell and a second cell, the first cell and the second cell being adjacent to each other in a first direction, and a first conductive line of the pre-conductive lines of the first cell extending in a second direction perpendicular to the first direction and being adjacent to a boundary between the first and second cells; and disposing post-conductive lines for forming the first cell and the second cell, a second conductive line and a third conductive line among the post-conductive lines of the second cell extending in the first direction and being adjacent to the boundary, wherein the second conductive line and the third conductive line are respectively disposed on two non-adjacent tracks among a plurality of tracks that extend in the first direction, and wherein the first conductive line intersects at least one of the two non-adjacent tracks and at least one track disposed between the two non-adjacent tracks.