| 发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF |
| 摘要 |
An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry. |
| 申请公布号 |
US2016300799(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615091049 |
申请日期 |
2016.04.05 |
| 申请人 |
Han Byung Joon;Shim Il Kwon;Park KyoungHee;Lin Yaojian;Koo KyoWang;Yoon In Sang;Chai SeungYong;Cho SungWon;Kim SungSoo;Lee Hun Teak;Yang DeokKyung |
发明人 |
Han Byung Joon;Shim Il Kwon;Park KyoungHee;Lin Yaojian;Koo KyoWang;Yoon In Sang;Chai SeungYong;Cho SungWon;Kim SungSoo;Lee Hun Teak;Yang DeokKyung |
| 分类号 |
H01L23/552;H01L21/56;H01L21/48;H01L23/498;H01L23/31 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; coupling an integrated circuit to the internal circuitry; forming a molded package body directly on the integrated circuit and the substrate top side of the substrate; and applying a conductive conformal shield structure directly on the molded package body, the vertical sides, and extending below the substrate bottom side for coupling the internal circuitry. |
| 地址 |
Singapore SG |
