PACKAGE SUBSTRATES AND METHODS OF FABRICATING THE SAME

摘要

A package substrate includes a core portion comprising a first surface and a second surface arranged opposite to each other; first cutting regions provided to penetrate at least a portion of the core portion in a thickness direction; a first upper circuit pattern disposed on the first surface of the core portion; and an insulating layer provided to cover the first surface of the core portion and to fill the first cutting regions. The first cutting regions are spaced apart from each other in a first direction that is substantially parallel to one side of the core portion.

主权项

1. A package substrate, comprising:
a core portion comprising a first surface and a second surface facing each other; cutting regions provided to expose at least a portion of an inside of the core portion; an insulating layer provided to cover the first and second surfaces of the core portion and fill the cutting regions; and circuit patterns disposed on the insulating layer, wherein a plurality of the cutting regions are spaced apart from each other in a first direction parallel to an extension direction of the core portion, wherein the cutting regions are provided on the first surface of the core portion to extend in a second direction perpendicular to the first direction.