| 发明名称 |
POWER MODULE AND THERMAL INTERFACE STRUCTURE THEREOF |
| 摘要 |
A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat. |
| 申请公布号 |
US2016300777(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615094038 |
申请日期 |
2016.04.08 |
| 申请人 |
DELTA ELECTRONICS,INC. |
发明人 |
HONG Shouyu;CHEN Yanlin;ZHAO Zhenqing |
| 分类号 |
H01L23/373;H01L23/367 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A thermal interface structure, comprising:
a base; and a plurality of filler particles distributed in the base; wherein when the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat. |
| 地址 |
TAOYUAN CITY CN |
