| 发明名称 |
INTEGRATION OF HEAT SPREADER FOR BEOL THERMAL MANAGEMENT |
| 摘要 |
A microelectronic device includes a heat spreader layer on an electrode of a component and a metal interconnect on the heat spreader layer. The heat spreader layer is disposed above a top surface of a substrate of the semiconductor device. The heat spreader layer is 100 nanometers to 3 microns thick, has an in-plane thermal conductivity of at least 150 watts/meter-° K, and an electrical resistivity less than 100 micro-ohm-centimeters. |
| 申请公布号 |
US2016300775(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201615183896 |
申请日期 |
2016.06.16 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Venugopal Archana;Denison Marie;Colombo Luigi;Pendharkar Sameer |
| 分类号 |
H01L23/367;H01L21/48;H01L23/373 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated circuit, comprising:
an electronic component having an electrode; a heat spreader layer positioned above the electrode, the heat spreader layer having an in-plane thermal conductivity of at least 150 watts/meter-° K; and a metal layer positioned above the heat spreader layer. |
| 地址 |
Dallas TX US |
