ELECTRONIC MODULE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE COMPRISING A MODULE OF SAID TYPE

摘要

The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.