发明名称 EPOXY RESIN MOLDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin molding material to which good impact resistance is imparted without deteriorating the excellent electric characteristics and heat resistance of conventional epoxy resin molding materials, and which has improved mechanical characteristics. SOLUTION: This epoxy resin molding material is characterized by containing an epoxy resin (a), a curing agent (b), an inorganic base material (c), and an acrylic resin (d) as essential components. Preferably, the epoxy resin (a) and the curing agent (b) are contained in a total amount of 10 to 25 wt. % on the basis of the total amount of the molding material, and the inorganic base material (c) is also contained in an amount of 60 to 80 wt. %. The acrylic resin (d) is contained in an amount of 10 to 30 pts. wt. per 100 pts. wt. of the total amount of the epoxy resin (a) and the curing agent (b). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005048011(A) 申请公布日期 2005.02.24
申请号 JP20030204514 申请日期 2003.07.31
申请人 SUMITOMO BAKELITE CO LTD 发明人 YUASA MICHIYUKI
分类号 C08L63/00;(IPC1-7):C08L63/00 主分类号 C08L63/00
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