发明名称 High frequency module
摘要 <p>A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes. </p>
申请公布号 EP1657826(A3) 申请公布日期 2007.05.02
申请号 EP20050024604 申请日期 2005.11.10
申请人 TDK CORPORATION 发明人 OKUYAMA, YUICHIRO;MATSUBARA, HIDEYA;NAKAI, SHINYA;IWATA, MASASHI
分类号 H04B1/40;H04B1/44;H05K3/46 主分类号 H04B1/40
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