| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method of cleaning and drying wafers which dry wafers without allowing a cleaning liquid to remain on each of the wafer, and can execute high-quality wafer cleaning/drying in which a watermark or residual particles on the wafer are prevented. SOLUTION: A small quantity of IPA (iso-propyl alcohol) for drying a wafer W is continuously supplied by IPA supplying means 6 onto the vicinity of a border line K between a wafer W surface to be formed on the wafer W dipped into the cleaning liquid 50 and the surface of the cleaning liquid 50. In this way, a concentration gradient is efficiently formed to execute high-quality cleaning/drying the wafer having no watermark and residual particles. COPYRIGHT: (C)2007,JPO&INPIT
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