| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method or the like of a ceramic electronic component which can manufacture a ceramic electronic component which ensures electrical connection of a mounting substrate to an electrode element and can realize a long life. SOLUTION: In the method of manufacturing a ceramic electronic component 10 by forming a plurality of bump electrodes in a bump electrode formation surface 10a of a ceramic electronic component body 11, a metallic paste 26 comprising Cu is applied by print to a plurality of places in the bump electrode formation surface 10a of the ceramic electronic component body 11. A metallic ball 22 of a uniform size constituted of Cu having a melting point higher than a baking temperature of the metallic paste 26 is mounted on the metallic paste 26 applied to a plurality of places. The metallic paste 26 is subjected to baking treatment at a temperature lower than a melting point of Cu constituting the metallic ball 22, thus obtaining a bump electrode. COPYRIGHT: (C)2007,JPO&INPIT
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