发明名称 PRINTED BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a connection structure and a connection method for a flexible board for enabling high density mounting by providing connection locations for the flexible board on the cross-section of a through-hole formed in a rigid board to reduce the mounting area required for the connection. SOLUTION: As to a printed board having the connection structure of the flexible board for the rigid board, micro-bumps are formed on the conductors in a joining surface of the flexible board, and the through-hole is formed in the rigid board. The conductor circuit thereof is exposed on the cross-section of the through-hole, the flexible board is inserted into the through-hole, and the micro-bumps and the exposed conductor circuit are connected together by fusing the solder of the micro-bumps. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220923(A) 申请公布日期 2007.08.30
申请号 JP20060039929 申请日期 2006.02.16
申请人 FUJITSU LTD 发明人 ABE MITSUNORI
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
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