发明名称 SEMICONDUCTOR DEVICE AND ITS INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and an inspection method of the semiconductor device which can prevent a needle deviation happening in the case of probing. SOLUTION: A groove 2 for inserting an inspection probe is formed in an electrode 1. The groove 2 consists of a base and sides. The width dimension of a base 3 becomes gradually small toward a peak 10. When inspecting, the inspection probe is inserted into the groove 2. Then, the inspection probe is guided towards a side with a small width dimension of the base 3. Then, two parts of the inspection probe contact the sides of the groove. Consequently, the sliding of the probe is controlled at the time of inspection. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220761(A) 申请公布日期 2007.08.30
申请号 JP20060037274 申请日期 2006.02.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 TATSUTAKE SHIRO;ITO KAZUHIKO;FUKUDA TSUYOSHI
分类号 H01L21/66;H01L21/3205;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L21/66
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