发明名称 PRESSURIZED CONNECTING DEVICE AND PRESSURIZED CONNECTING METHOD OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a pressurized connecting device of electronic component for pressurizing a circuit substrate and a tab with uniform pressure for pressurized connection of these elements with a pressurizing tool. SOLUTION: The pressurized connecting device of electronic components overlaps an end of a first electronic component and an end of a second electronic component, and connects with pressure the overlapping part of these electronic components. The pressurized connecting device comprises a backup tool 12 that is divided into a plurality of backup portions 13 to locate an end of a circuit substrate 203 to an upper end surface of these backup portions; a pressurizing tool 18 for connecting the circuit substrate and an end of the tap by applying pressure to the end of the tap 202 overlapped to one end of the circuit board located on the backup tool; and an elastic member 15 for respectively displacing the backup portions in accordance with difference in the pressures of the pressuring tool applied to the plurality of backup portions, via the circuit board and tag at the time of connecting the circuit board and one end of tab by applying pressure with the pressurizing tool. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007220727(A) 申请公布日期 2007.08.30
申请号 JP20060036634 申请日期 2006.02.14
申请人 SHIBAURA MECHATRONICS CORP 发明人 KAWABE KATSUYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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