| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical transmission module of small size and high reliability, on which an optical module is mounted. <P>SOLUTION: The optical module 1 is mounted on a circuit board 3 via a base stem 2, and the circuit board 3 is fixed to a case 4. The lead 1c of the optical module 1 is connected, by soldering parallel to a connection pad 3a of the circuit board 3 for electrical connection. The connection surface 3b of the base stem 2 and the circuit board 3 is substantially identical with the surface of the lead connection pad 3a of the circuit board 3. Thus, the thermal stress of the lead 1c in the substrate thickness direction is relaxed for the actual optical transmission module of small size and high reliability. <P>COPYRIGHT: (C)2008,JPO&INPIT |
