APPARATUS FOR SEMICONDUCTOR CHIP PACKAGING

摘要

A semiconductor chip packaging apparatus is provided to remove a leaked molding material, which is excessively sealed in a sprocket hole of a substrate, by lowering a cutting member. A semiconductor chip packaging apparatus comprises an upper body(100), a lower body(200), and a position guider(300). The upper body includes a cutting member(110). The lower body is installed opposite to the upper body and includes a loading unit(210). The loading unit is configured to load a package carrier(500) having a leaked molding material(520) to be removed by the cutting member. The position guider adjusts the distance between the upper body and the lower body, guiding the movement of the cutting member. The cutting member is a strip knife or a strip wire.