Light-emitting semiconductor component, particularly light emitting diode, has substrateless light emitting diode semiconductor chip, and two connections are provided for contacting of semiconductor chip

摘要

The light-emitting semiconductor component (1) has a substrateless light emitting diode semiconductor chip (2). Two connections are provided for the contacting of the semiconductor chip. A cooling arrangement (3) is arranged under the semiconductor chip with a metal layer (4), which forms an electrical connection of the cooling arrangement. A highly doped semiconductor layer (5) is provided, which is a silicon layer. A contact layer, particularly a gold layer (11) is arranged between the metal layer and the substrateless light emitting diode chip.