| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a recessed chip having a cover member closely bonded and fixed thereto and capable of effectively preventing the leak of a sample liquid. <P>SOLUTION: A photosensitive material layer 12 is formed to a substrate 11 by coating the substrate 11 with a photosensitive material and cover glass 13 is laminated to the photosensitive material layer 12 to be closely bonded thereto. Thereafter, the photosensitive material layer 12 is exposed to light through the cover glass 13 and developed to form a sample charging tank 21, a waste liquid tank 22, a flow channel 23 and a silica tank 25. If the flow channel 23 or the like is formed to the photosensitive material layer 12 as is conventional and covered with the cover glass 13 after cured, a gap is formed between the cover glass 13 and the photosensitive material layer 12 by the irregularity of the thickness of the photosensitive material layer 12 and a sample solution is leaked from the flow channel 23 to be penetrated in the gap. The photosensitive material layer 12 is cured by this manufacturing method after the cover glass 13 is placed, the cover glass 13 and the photosensitive material layer 12 can be closely bonded. <P>COPYRIGHT: (C)2008,JPO&INPIT |
