发明名称 METHOD AND DEVICE OF MOUNTING CONDUCTIVE BALLS
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of mounting conductive balls which can enhance an adhesion between a mask and a member to be arrayed while avoiding generation of excessive balls in mounting the conductive balls on the array member with use of the mask, and to provide a device for mounting the balls. <P>SOLUTION: The method relates to mounting conductive balls on a member to be arrayed with use of a predetermined array pattern and includes a positioning step of positioning a mask relative to the array member, a pushing step of pushing the mask under influence of a fluid, and an inserting step of inserting conductive balls in positioning openings of the mask formed as the predetermined array pattern. When the surface of the mask to be pushed under influence of the liquid forms part of the inner wall of a tightly-sealed chamber, it is preferable that the pressure of the liquid for pushing the mask nearly uniformly act on the mask in a direction of the flat surface of the mask. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008091633(A) 申请公布日期 2008.04.17
申请号 JP20060271018 申请日期 2006.10.02
申请人 HITACHI METALS LTD 发明人 ITO MOTOMICHI;KUBO KENICHI
分类号 H01L21/60;H01L23/12;H05K3/34 主分类号 H01L21/60
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