POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed are a power module package and a manufacturing method thereof. The power module package includes: a resin case integrally molded with an external connection terminal; a metal plate having a coupling unit on a side surface and integrally molded with the resin case with the coupling unit coupled to an inner side of the resin case to seal the bottom of the resin case; a circuit substrate formed on the metal plate; and a semiconductor device mounted on the circuit substrate. According to one embodiment of the present invention, the power module package has an excellent sealing performance.