| 发明名称 | Printed wiring board and method for manufacturing printed wiring board | ||
| 摘要 | A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated. | ||
| 申请公布号 | US9307645(B2) | 申请公布日期 | 2016.04.05 |
| 申请号 | US201313938637 | 申请日期 | 2013.07.10 |
| 申请人 | IBIDEN Co., Ltd. | 发明人 | Mano Yasuhiko;Yoshikawa Kazuhiro;Kariya Takashi |
| 分类号 | H05K1/16;H05K3/30;H05K1/18;H05K1/02;H05K3/00;H05K3/46 | 主分类号 | H05K1/16 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A printed wiring board, comprising: a core substrate; a first buildup layer formed on a first surface of the core substrate and comprising an insulation layer and a conductive layer; a second buildup layer formed on a second surface of the core substrate on an opposite side with respect to the first buildup layer and comprising an insulation layer and a conductive layer; and an inductor device positioned in the second buildup layer and comprising a resin insulation layer and a coil layer formed on the resin insulation layer, wherein the second buildup layer has a cavity in which the inductor device is accommodated. | ||
| 地址 | Ogaki-shi JP | ||