| 发明名称 |
SILICA FOR CMP, AQUEOUS DISPERSION, AND PROCESS FOR PRODUCING SILICA FOR CMP |
| 摘要 |
To reduce scratches during polishing while ensuring an appropriately high polishing rate, provided are a silica for CMP satisfying the following (A) to (C), an aqueous dispersion using a silica for CMP, and a method of producing a silica for CMP: (A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less. |
| 申请公布号 |
US2016177155(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414904565 |
申请日期 |
2014.07.10 |
| 申请人 |
TOKUYAMA CORPORATION |
发明人 |
NAKAMURA Masahiro;ISHIMOTO Ryuji |
| 分类号 |
C09K3/14;C01B33/18 |
主分类号 |
C09K3/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A silica for CMP, which satisfies the following (A) to (C):
(A) a BET specific surface area of 40 m2/g or more and 180 m2/g or less; (B) a particle density measured by a He-gas pycnometer method of 2.24 g/cm3 or more; and (C) a coefficient of variation in primary particle diameter calculated by TEM/image analysis of 0.40 or less. |
| 地址 |
Shunan-shi, Yamaguchi JP |
