Epoxy Resin Containing Silicone-Modified Epoxy Resin and Polyvalent Carboxylic Acid Compound, and Cured Product Thereof

摘要

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):
(A) a silicone-modified epoxy resin having a cyclic siloxane structure,(B) a silicone-modified epoxy resin having a branched siloxane structure, and(C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.

主权项

1. An epoxy resin composition comprising the following components (A) to (C):
(A) a silicone-modified epoxy resin represented by the formula (1), wherein R1 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; X represents an organic group having at least an epoxy group; n represents an integer of 1 to 3; and a plurality of groups R1 or X present in the formula are the same or different from each other; (B) a silicone-modified epoxy resin represented by the formula (2), wherein R1 and X are each as defined above; and a plurality of groups R1 or X present in the formula are the same or different from each other; and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid represented by the formula (3) and a carboxylic anhydride compound:wherein R is selected from the group consisting of methyl, COOH and H.