| 摘要 |
The invention relates to a vacuum chamber for treating substrates, which comprises at least the following elements: heat-feeding elements for feeding heat into a treatment region of the vacuum chamber, in which treatment region at least one substrate (10) can be treated; a chamber wall (20), through which the heat can be removed from the treatment region and which has an inner chamber wall side and an outer chamber wall side; and a shielding wall (30), which is arranged between the chamber wall (20) and the treatment region in such a way that a shielding wall side facing away from the treatment region is placed facing the inner chamber wall side, characterized in that the shielding wall side placed facing the inner chamber wall side is at least partially, preferably largely, provided with a first layer (31), which has an emissivity ε ≥ 0.65. |
