发明名称 Airdome enclosure for components
摘要 A component having an airdome enclosure that protects the component from its external environment. An airdome enclosure according to the present techniques avoids the high costs of employing special materials and/or specialized process steps in the manufacture of a component. An electronic component according to the present techniques includes a set of substructures formed on a substrate and an airdome enclosure over the substructures that protects the substructures and that hinders the formation of parasitic capacitances among the substructures.
申请公布号 US2005170605(A1) 申请公布日期 2005.08.04
申请号 US20040769935 申请日期 2004.02.02
申请人 WEI JOHN S.S.;PARKHURST RAY M.;JENNISON MICHAEL J.;NIKKEL PHILIP G. 发明人 WEI JOHN S.S.;PARKHURST RAY M.;JENNISON MICHAEL J.;NIKKEL PHILIP G.
分类号 H01L21/44;H01L21/4763;H01L21/48;H01L21/50;H01L21/76;H01L23/31;H01L23/522;(IPC1-7):H01L21/44;H01L21/476 主分类号 H01L21/44
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