SEMOCONDUCTOR PACKAGE AND SEMOCONDUCTOR PACKAGE MODULE INCLUDING THE SAME

摘要

A semiconductor package and a semiconductor device module setting up the same are provided to improve package yield as a lead classified as a plurality of pin groups is included and a plurality of pins having a identical function exists. A semiconductor package comprises a plurality of semiconductor chips and leads(151,152). The lead is connected with the pad of the semiconductor chip and is exposed to outside. The lead is classified as a plurality of pin groups. The semiconductor chip is classified as a plurality of chip groups. The pad of the semiconductor chip belonging to the same chip group is connected to the lead belonging to the same pin group.