发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treatment device for preventing the film separation of a resist cover film. SOLUTION: A reflection preventive film heat treatment part has a heat treatment unit TP which consists of a cover type nozzle 221 covering the upper part of a substrate supported by a heat treatment plate 210 for discharging adhesion reinforcing agent to the peripheral edge of the substrate supported by the heat treatment plate 210, and a vaporizing treatment device 222 for supplying the adhesion reinforcing agent in a gas phase to the cover type nozzle 221. A control part 911 executes adhesion reinforcing treatment with the cover type nozzle 221 discharging the adhesion reinforcing agent in a gas phase to the peripheral edge of the substrate W during heat treatment given to the substrate W placed on the heat treatment plate 210. This reinforces the adhesion of the resist cover film at the peripheral edge of the substrate W to the surface of the substrate while giving no influences to throughput because the heat treatment is performed parallelly with the adhesion reinforcing treatment. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009088384(A) 申请公布日期 2009.04.23
申请号 JP20070258693 申请日期 2007.10.02
申请人 SOKUDO:KK 发明人 TAMADA OSAMU;SANADA MASAKAZU;MIYAGI SATOSHI
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址