发明名称 SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD, AND HARD DISC DRIVE
摘要 PROBLEM TO BE SOLVED: To provide a suspension substrate that allows connection workability between the suspension substrate and an actuator element by a conduction adhesive to be enhanced.SOLUTION: A suspension substrate 1 according to the present invention comprises: an insulation layer 10; a metal support layer 11 that is provided on one face of the insulation layer 10; and a wiring layer 12 that is provided on the other face of the insulation layer 10, and has a plurality of wiring 13 and a wiring connection part 16 to be electrically connected to an actuator element 44 via a conductive adhesive. The metal support layer 11 is provided in a connection structure region 3, and has a frame body section 17 including a metal support layer injection hole 32 to which the conductive adhesive is injected. An outer edge 17a of the frame body section 17 of the metal support layer 11 is positioned inwardly from an outer edge 10a of the insulation layer 10. An observation hole 30 is provided that penetrates through the insulation layer 10 and allows a state of the conductive adhesive to be externally observed upon injecting the conductive adhesive to the metal support layer injection hole 32.SELECTED DRAWING: Figure 1
申请公布号 JP2016131055(A) 申请公布日期 2016.07.21
申请号 JP20160052963 申请日期 2016.03.16
申请人 DAINIPPON PRINTING CO LTD 发明人 ONUKI MASAO;YAMAZAKI TSUYOSHI
分类号 G11B5/60;G11B21/10;G11B21/21 主分类号 G11B5/60
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