ELECTRONIC DEVICE COOLING

摘要

An electronic device with passive internal cooling is disclosed. The electronic device comprises a printed wiring board (PWB), an electronic element operable to produce heat connected to the PWB, a movable heat transmission element, and a heat transmission interface. The electronic device is operable in a first state and a second state. In the first state the movable heat transmission element is configured to be in thermal contact with the heat transmission interface and the electronic element operable to produce heat, and in the second state there is a space between the movable heat transmission element and the heat transmission interface. The electronic device is configured to enter the first and second states via movement of the movable heat transmission element. A system and a method for cooling electronic devices are also disclosed.