| 摘要 |
PROBLEM TO BE SOLVED: To suppress intrusion of moisture into an adhesive layer in a printed wiring board 10 from the outside.SOLUTION: A printed wiring board 10 includes a first insulating base material 11, a first electrode 11a provided in a first region A1 on one principal surface of the first insulating base material 11, a first adhesive part 14 provided in a second region A2 located on the first direction side for the first region A1, and a first silicon resin part 15 provided in a third region A3 located on the first direction side for the second region A2.SELECTED DRAWING: Figure 4 |
