| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of adjusting process liquid supplied to a substrate to a constant amount.SOLUTION: At a moment in time of t1, a discharge valve and a suck-back valve are closed, and a pre-stop valve is opened. In this state, a chemical liquid is not supplied to a process liquid nozzle. At a moment in time of t2, the discharge valve is opened. Consequently, the chemical liquid is supplied from the process liquid nozzle to a substrate. In this case, the supply flow rate to the process liquid nozzle is a process liquid flow rate F1. At a moment in time of t3, the pre-stop valve is closed. Consequently, the supply flow rate to the process liquid nozzle decreases to a limit flow rate F2. At a moment in time of t4, the discharge valve is closed. Consequently, supply of the chemical liquid to the process liquid nozzle is stopped, and discharge of the chemical liquid from the process liquid nozzle is stopped. Thereafter, at a moment in time of t5, the suck-back valve is opened. Consequently, the liquid level in the process liquid nozzle is lifted.SELECTED DRAWING: Figure 5 |
