发明名称 THERMALLY CONDUCTIVE RESIN SHEET AND POWER MODULE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet which secures high thermal conductivity by charging an inorganic filler at a high filling rate, secures processability by mixing resin, and also secures superior electrical insulation by suppressing void formation, and to provide a power module that uses the sheet. <P>SOLUTION: A thermally conductive sheet contains resin and a filler which is coated with a surfactant and has thermal conductivity and exhibit insulation, and the filler is dispersed in the resin. Alternatively, a thermally conductive sheet contains a thermally conductive filler and an insulative filler and a surfactant, and the filler and surfactant are dispersed in the resin. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009004536(A) 申请公布日期 2009.01.08
申请号 JP20070163596 申请日期 2007.06.21
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITO HIROMI;MIMURA KENJI;TAKIGAWA HIDEKI;NISHIMURA TAKASHI;YAMAMOTO KEI;TOYOSHIMA TOSHIYUKI;SHIODA HIRONORI;FUJINO ATSUKO;HIRAMATSU SEIKI
分类号 H01L23/373;H01L25/07;H01L25/18 主分类号 H01L23/373
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