MICROWAVE PROCESSING APPARATUS FOR SELECTIVE HEATING OF MICRO-STRUCTURED CONDUCTIVE PATTERNS

摘要

Disclosed is a microwave processing apparatus for heat-treating a structure with a micro- or nano-sized conductive pattern. The microwave processing apparatus according to the present invention includes a microwave oven for heat-treating a sample to be heated; a magnetron for outputting a microwave to the microwave oven; a pulse power supply for applying a pulse voltage to the magnetron; and a microwave oven controller for controlling the pulse power supply, wherein the microwave oven controller controls such that a microwave having a pulse width of 100 ms or less is applied to the microwave oven. According to the present invention, a microwave processing apparatus which is capable of selectively heating a conductive pattern without damaging a periphery material or a matrix may be provided.