| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost method of manufacturing a light emission device in which a failure hardly occurs.SOLUTION: A light emitting device 10 includes a base material 11, an adhesive layer 13, lead materials 15, 16, an LED chip 18, and a sealing material 19. A method of manufacturing the light emitting device 10 comprises first to sixth steps. In the first step, a second film on which the adhesive layer 13 is formed is adhesively attached to a base material 11 adhering on the surface of a first film to transfer the adhesive layer 13 onto the surface of the base material 11. In the first step, the second film is peeled off and removed from the base material 11. In the third step, lead materials 15 and 16 are adhesively fixed to the adhesive layer. In the fourth step, the first film is peeled off and removed from the base material 11. In the fifth step, the LED chip 18 is mounted on the lead materials 15, 16. In the sixth step, using a potting method, the LED chip 18 and the lead materials 15, 16 are sealed with a sealing material to form a package 20.SELECTED DRAWING: Figure 7 |
