发明名称 IMPRINTING METHOD AND IMPRINTING DEVICE
摘要 An imprinting method includes a resin application process of applying a light curing resin so that the resin covers a surface of the substrate and protrudes from an outer periphery of the substrate to contact an adhesive sheet in a state where a reverse surface of the substrate is adhered to the adhesive sheet, an advance curing process of curing the light curing resin contacting the adhesive sheet by irradiating the substrate with light from the reverse surface side, a pressurizing process of pressing a fine pattern formed in a mold onto the light curing resin on the surface of the substrate, a curing process of curing the light curing resin on the surface of the substrate by irradiating the substrate with light from the surface side and a mold releasing process of releasing the mold from the light curing resin by performing peeling from a portion cured on the adhesive sheet.
申请公布号 US2016332341(A1) 申请公布日期 2016.11.17
申请号 US201614997535 申请日期 2016.01.17
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 IWASE TEPPEI;ISHIKAWA AKIHIRO;WADA TOSHIHIKO
分类号 B29C43/50;B29C35/08 主分类号 B29C43/50
代理机构 代理人
主权项 1. An imprinting method comprising: a resin application process of applying a light curing resin so that the resin covers a surface of the substrate and protrudes from an outer periphery of the substrate to contact an adhesive sheet in a state where a reverse surface of the substrate is adhered to the adhesive sheet; an advance curing process of curing the light curing resin contacting the adhesive sheet by irradiating the substrate with light from the reverse surface side; a pressurizing process of pressing a fine pattern formed in a mold onto the light curing resin on the surface of the substrate; a curing process of curing the light curing resin on the surface of the substrate by irradiating the substrate with light from the surface side; and a mold releasing process of releasing the mold from the light curing resin by performing peeling from a portion cured on the adhesive sheet.
地址 Osaka JP